Besi

Besi, short for BE Semiconductor Industries N.V., is a Dutch multinational supplier of equipment used in semiconductor assembly and packaging. The company designs and manufactures systems for attaching semiconductor dies, packaging integrated circuits, and plating components or substrates used in electronic and energy applications. Its equipment serves the part of the semiconductor value chain that follows wafer fabrication, where individual dies are assembled into packages that provide electrical connections, mechanical protection, thermal management, and integration into finished electronic products. Founded in May 1995 by Richard Blickman, Besi developed as a focused semiconductor back-end equipment company. Blickman remains associated with the company’s leadership. Besi is headquartered in Duiven in the Netherlands and operates internationally, with production outsourced to subsidiaries in China and Malaysia. At the end of 2022, the company had 1,675 permanent employees and 144 temporary employees. The company’s principal business areas are die attach, packaging, and plating. Die attach systems position and connect semiconductor dies within packages or on substrates. Besi’s die attach portfolio includes flip-chip, hybrid bonding, and thermo-compression technologies, which address increasingly demanding requirements for miniaturization, interconnect density, power efficiency, and heterogeneous integration. Packaging equipment supports the assembly of semiconductor devices into usable packages, while plating systems are used in applications including solar cells, connectors, and other electrical devices. Die attach has been Besi’s most important activity by revenue. The segment represented approximately 82% of company revenue in 2021 according to the cited reference material. Besi was also described as a leading supplier in this segment, with an estimated 42% market share in 2022. These figures indicate a business positioned around specialized, technically demanding equipment rather than high-volume consumer products. Its customers and end markets are tied to semiconductor manufacturing, electronics production, advanced packaging, automotive and industrial electronics, communications, computing, and other applications that require packaged integrated circuits. Besi is listed on Euronext Amsterdam under the ticker BESI. The company’s public-market identity and international manufacturing footprint distinguish it from a consumer-facing brand: its reputation is primarily based on process technology, equipment performance, production yield, and relationships with semiconductor manufacturers and assembly providers. Besi’s strategic relevance is linked to the growing importance of advanced packaging, including technologies that allow multiple dies or chiplets to be integrated in compact systems. The available reference material does not establish a complete current product catalog, detailed geographic revenue split, or a current corporate website, so those details are left unspecified here.

Besi was established in May 1995 in the Netherlands by Richard Blickman. From its beginning, the company focused on semiconductor assembly equipment, a segment commonly referred to as the semiconductor back end. Rather than fabricating chips itself, Besi develops machinery that helps manufacturers attach semiconductor dies, assemble packages, and apply plating used in electronic components and related products. The company’s development has been closely connected with the increasing technical importance of semiconductor packaging. As chips have become smaller and more powerful, packaging has evolved from a protective enclosure into a significant part of system performance. Packaging processes determine how dies are connected, how heat is managed, and how multiple components can be combined. Besi’s equipment portfolio therefore expanded around die attach and related assembly technologies, including flip-chip, hybrid bonding, and thermo-compression approaches. Besi also developed packaging and plating activities. Its plating systems serve applications such as solar cells, connectors, and other electrical devices, giving the company exposure beyond conventional integrated-circuit assembly. Nevertheless, die attach has remained its central business area. The cited reference material states that die attach accounted for about 82% of revenue in 2021 and that Besi held an estimated 42% share of the die attach market in 2022, identifying it as a market leader in that segment. Besi operates as an international company headquartered in Duiven, the Netherlands. Production is outsourced to subsidiaries in China and Malaysia, reflecting an operating model that combines Dutch corporate and engineering roots with Asian manufacturing capabilities. At the end of 2022, the company had 1,675 permanent employees and 144 temporary employees. Besi became a publicly traded company whose shares are listed on Euronext Amsterdam under the symbol BESI. Its public listing provides access to capital markets while its business remains focused on specialized industrial technology. Richard Blickman, the founder, continued to lead the company according to the cited material. The available source set does not provide a complete chronology of acquisitions, leadership transitions, product launches, financial results, or geographic expansion, so no additional milestones are asserted.

1. 2022Besi is described as a die attach market leader

   The cited reference material reports that Besi held approximately 42% of the die attach market in 2022.

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2. 2022Reported workforce and manufacturing footprint

   At the end of 2022, Besi had 1,675 permanent employees and 144 temporary employees, with production outsourced to subsidiaries in China and Malaysia.

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3. 2021Die attach remains the dominant business

   Die attach solutions accounted for approximately 82% of Besi’s revenue in 2021 according to the cited reference material.

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4. 1995Besi is founded

   Richard Blickman founded BE Semiconductor Industries in the Netherlands in May 1995, establishing the company as a semiconductor assembly equipment supplier.

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A specialized, globally operating semiconductor back-end equipment supplier with a strong position in die attach and advanced packaging technologies.

• Die attach equipmentSemiconductor assembly equipment

  Besi’s die attach systems place and connect semiconductor dies within packages or on substrates. This is the company’s principal product area and includes equipment for conventional and advanced assembly processes. The systems are used where accuracy, throughput, alignment, bonding quality, and package reliability are critical to semiconductor production.

• Flip-chip solutionsAdvanced semiconductor packaging

  Flip-chip equipment supports the mounting of semiconductor dies with their contact surfaces oriented toward the package substrate. The approach can provide compact electrical interconnection and is used in applications requiring high interconnect density and efficient package design. Besi identifies flip-chip technology as part of its die attach portfolio.

• Hybrid bonding solutionsAdvanced semiconductor packaging

  Hybrid bonding equipment supports advanced interconnection processes in which semiconductor structures are joined through closely aligned bonding surfaces. Such technology is associated with high-density integration and emerging packaging architectures. The available reference material names hybrid bonding as one of Besi’s die attach offerings but does not provide specific model names or launch dates.

• Thermo-compression solutionsSemiconductor bonding equipment

  Thermo-compression equipment uses controlled heat and pressure to form semiconductor interconnections during assembly. It is part of Besi’s die attach and advanced packaging portfolio and addresses packaging processes where controlled bonding conditions and precise placement are required.

• Packaging equipmentSemiconductor packaging equipment

  Besi supplies equipment used in semiconductor packaging, the stage in which individual dies are assembled into packages for integration into electronic products. The available sources do not enumerate every packaging system or product family, but describe packaging as one of the company’s three principal solution areas alongside die attach and plating.

• Plating solutionsIndustrial plating equipment

  Besi’s plating products apply plating processes used in solar cells, connectors, and other electrical devices. This business broadens the company’s activities beyond semiconductor die attachment and packaging, although the available reference material does not specify product models, capacity, or customer names.

1. Besi