Journey 2
The Journey 2 was released in 2019, and was the first automotive AI chip made by a Chinese company. It uses Horizon's self-developed Brain Processing Unit (BPU)2.0 architecture, and is capable of over 4 TOPS of compute performance while consuming 2 watts of power.[12] It has a multicore CPU consisting of ARM Cortex-A53 cores clocked at up to 1.5GHz, 640GB/s internal bandwidth bus,[13][14]
Journey 3
The Journey 3 was released in September 2020. It continues to use the BPU2.0 architecture and is fabricated on TSMC's 16nm node, now providing 5TOPS while using 2.5 watts of power.[12] Applications include Li Auto One.
Journey 5
The Journey 5 uses eight ARM Cortex-A55 in its CPU for 26k DMIPS, and has a GPU capable of 128TOPS using Horizon's Bayesian BPU architecture. Its ISP is capable of handling 16 HD cameras and supports 4x4 MIPI to support 4K cameras. It is produced on TSMC's 16nm FinFET process node.[15] It received SGS-TÜV's ISO 26262 ASIL-B automotive safety certification in June 2021.[16][17] Unlike the previous chips in the Journey series, which were primarily used with CNN models, the Journey 5 chips are the first in the series to be optimized for use with Transformer models.[18]
Journey 6
The Journey 6 generation of chips was first teased in 2023, with specs of only the top of the line 6P revealed. The full lineup of chips was announced on 25 April 2024, when more details specifications of the 6B, 6E, 6M, and 6P were revealed at the launch presentation. This generation introduces the BPU3.0 architecture known as Nash, the use of larger ARM Cortex-78AE cores from the high-performance Cortex-A7X series which are capable of out-of-order execution, and 3D GPU visualization using ARM's Mali G78AE architecture rather than using a digital signal processor. According to Horizon, the Nash BPU architecture was designed to handle high-parameter transformer models, and is optimized to run end-to-end architectures.[19][20] The Journey 6 series integrates the CPU, BPU, GPU, and MCU into a single SoC, increasing performance while reducing cost, power consumption, and simplifying board design.[21] This high degree of integration and hardware simplification allows the Journey 6 to act as a plug-and-play solution, allowing for easy hardware upgrades for automakers and users which Horizon compares to upgrading a desktop PC's graphics card.[22]
Journey 6B
The Journey 6B was announced on 25 April 2024 and is aimed at entry-level active safety ADAS solutions. Horizon Robotics said that the chip got orders from Tier 1 suppliers Bosch and Denso, along with NavInfo, Furuitech and Youjia Innovation.[19] It is intended to be the successors to the Journey 2 and Journey 3 chips.
Journey 6E & 6M
The Journey 6E and 6M are positioned as cost effective solutions for highway NOA systems with some urban capabilities. It meets the AEC-Q104 standard and reduces costs and power consumption through high integration. It is intended to be the successors to the Journey 5 chips.
Initial automotive customers include SAIC, Volkswagen Group, BYD, Li Auto, GAC, Deepal, BAIC, Chery, Exeed Sterra, and Voyah, and Tier 1 customers include Bosch, Luxshare, Huaqin, and TzTek, with interest shown from Continental, Denso, Valeo, and ZF.[19]
Journey 6P
The Journey 6P is the most powerful chip design by Horizon Robotics to date, and is intended for high-end full-scenario NOA solutions. The chip contains 37 billion transistors and is fabricated on TSMC's 7nm, and contains a 18-core CPU capable of 410kDMIPS, is capable of 560TOPS from its 4 Nash BPU cores, and uses LPDDR5x8533RAM for a total of 204GB/s of bandwidth. It has an ISP with 24 channels capable of processing 4Kvideo or other sensors including up to 18MP front-facing cameras, mmWave radar and LiDAR data.[22]
Mass production of the 6P is expected to start in the third quarter of 2025.
Journey 7
In March 2026, Horizon announced plans for the Journey 7 family of chips, which is expected to arrive in 2027. Compared to their previous chip generations like the Journey 6, the design is led by the algorithm team's needs rather than the chip design team to better match. It will use Horizon's fourth generation BPU architecture named Riemann. Horizon says that the top chip in the family, the J7P, aims to significantly surpass the performance of the 1000 TOPS Nvidia Thor-X and compete with Tesla's upcoming AI5 chip, which is rumored to have around 2000–2500 TOPS of performance.[23][24][25][26][27]
Carizon C7H
In March 2026, Horizon's joint venture with Volkswagen, known as Carizon (sytlized 'CARIZON') announced that it was developing the C7H chip. Development is primarily being done by Carizon itself, with some support from CARIAD and Horizon. It is based on Journey 7 family and uses the Riemann BPU architecture, will be fabricated on a 4nm or 3nm process node, and will have a per-chip performance of around 500–700 TOPS. It is intended to be used in Volkswagen's vehicles using the CEA architecture codeveloped with XPeng.[23][26][28][29]
