Amkor Technology

Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona since 2005, when it was moved from West Chester, Pennsylvania, also in the United States.[5] The company's Arizona headquarters was originally in Chandler,[6] then later moved to Tempe. The company was founded in 1968 and, as of 2022, has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.

With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.

Etymology

Amkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea".[7]

History

Amkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq.[7]

In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in the United States.[8] In 2005, Amkor spun off Integra Technologies.[9]

In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan.[10][11]

In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year.[12]

Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan.[13]

In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.

A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023.[14]

Products

Amkor's designs, packages and tests semiconductors for other companies. The company's offers include RF-antenna designs incorporated directly into or onto a chip,[15] CMOS imaging sensors[16] or flip chip packaging with copper pillar bumps.[17][18] Amkor also offers wire bonding of semiconductors to packages[19] as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge Protection".[20][21]

See also

  • Semiconductor industry
  • Integrated circuit packaging
  • Wafer-level packaging
  • System in a package

References

  1. Giel Rutten^
  2. Jeff Gifford. Valley semiconductor company names new CEO Phoenix Business Journal, June 18, 2020^
  3. Amkor Technology – Company History retrieved 2018-01-08^
  4. US SEC: Form 10-K 2013 U.S. Securities and Exchange Commission, February 16, 2024, retrieved February 17, 2024^
  5. Amkor’s outlook improved as it moves headquarters EETimes^
  6. Amkor relocates to Arizona - Philadelphia Business Journal 2023-12-05, retrieved 2023-12-05^
  7. Company History Amkor Technology, retrieved January 27, 2024^
  8. 2000 Annual Report Amkor Technology, 2001^
  9. Amkor spin-off Integra focuses on test EE Times, October 10, 2005^
  10. Amkor Tech finishes 100 percent buy of a Japanese semiconductor company bizjournals.com, February 11, 2016, retrieved 2025-05-09^
  11. Amkor Completes Semiconductor Packaging Firm Nanium's Buyout nasdaq.com, May 24, 2017^
  12. Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm Bloomberg.com, 15 June 2017, retrieved 2020-03-17^
  13. Amkor opens new semiconductor package manufacturing and test plant in Taiwan electroiq.com, retrieved 2018-09-25^
  14. Amkor to build $2 billion Arizona semiconductor packaging plant reuters.com, 2023-11-30, retrieved 2023-12-20^
  15. FAQ: Antenna-in-package answers the “last mile” RF challenge, Part 2 5gtechnologyworld.com, 2023-06-06, retrieved 2024-10-23^
  16. Amkor claims 13% of outsourced CMOS image sensor packaging eetimes.com, 2002-11-05, retrieved 2024-10-23^
  17. Amkor Technology and Texas Instruments Deliver Industry’s First Fine Pitch Copper Pillar Flip Chip Packages to Market techonline.com, retrieved 2024-10-23^
  18. Amkor looks to EU CHIPS Act for semiconductor packaging in Portugal eenewseurope.com, 2022-10-25, retrieved 2024-10-23^
  19. Wirebonding Is Here To Stay semiengineering.com, 2023-10-19, retrieved 2024-10-23^
  20. Enhancing Punch MLF Packaging with Edge Protection Technology semiengineering.com, 2023-06-14, retrieved 2024-10-23^
  21. Amkor's Edge Protection™ Technology semiconductorpackagingnews.com, retrieved 2024-10-23^